Download Capabilities Document
| Standard | Advanced | |
| Single Sided | Max. 510 x 610mm | |
| Double Sided Non PTH | Max. 510 x 610mm | |
| Silver Through Hole | Max. 510 x 610mm | |
| PTH | Max. 457 x 610mm | Max. 610 x 1000mm |
| Multilayer | Max. 457 x 610mm | Max. 610 x 1000mm |
| Layer count | Up to 20 | Up to 58 |
| Standard | Advanced | |
| FR1 | Yes | Yes |
| FR2 | Yes | Yes |
| CEM-1 | Yes | Yes |
| CEM-3 | Yes | Yes |
| FR4 (Standard & Hi-TG) | ITEQ, Kingboard, Shengyi, Nanya, Grace, Isola, Ventec, EMC | Nelco, Rogers, Panasonic, Taconic, others available on request |
| Polyimide | Ventec, Arlon, Nelco | |
| Aluminium | Denka, Bergquist, Laird, Ventec | Denka, Bergquist, Laird, Ventec |
| Ceramic | Al2O3, AlN, SiN (DBC, DPC & AMB) | Al2O3, AIN, SiN (DBC, DPC & AMB) |
| Pre-pregs | 106, 1080, 2113, 2116, 2125, 7628 | 106, 1080, 2113, 2116, 2125, 7628, 106NF, 1080NF |
| Other Materials | Please Enquire | Please Enquire |
| Standard | Advanced | |
| Single Sided | ½oz (18µm) – 2oz (70µm) | 30oz (1050µm)* |
| PTH | ½oz (18µm) – 6oz (210µm) | 30oz (1050µm)* |
| Multilayer (Outer layers) | 12µm – 6oz (210µm) | 30oz (1050µm)* |
| Multilayer (Inner Layers) | ½oz (18µm) – 6oz (210µm) | 15oz (525µm)* |
| Metal Clad PCB | 1oz (35µm) – 6oz (210µm) | 30oz (1050µm)* |
| ASPECT RATIO | 10:01 | 16:01 |
| *Maximum copper thickness depends on design. | ||
| Standard | Advanced | |
| Hot Air Solder Level | Yes | Yes |
| Lead Free Hot Air Solder Level | Yes | Yes |
| ENEPIG | Yes | Yes |
| EPAG | Yes | Yes |
| Immersion Gold (ENIG) | Yes | Yes |
| Immersion Silver | Yes | Yes |
| Immersion Tin | Yes | Yes |
| Hard Gold & Gold Finger | Yes | Yes |
| OSP | Yes | Yes |
| Standard | Advanced | |
| Photoimageable (LPI) Solder Mask | Green, Blue, White, Black | Red, Orange, Purple, Grey & Others on request |
| Via Plugging | Yes | Yes |
| Peelable Solder Mask | Standard & Hi-Temp—Blue, Green, Red | Standard & Hi-Temp—Blue, Green, Red |
| UV Curable ident (Silkscreen) | White, Yellow, Black | Green, Red, Blue, Brown |
| Carbon Key Pads | Yes | Yes |
| Carbon Links | No | Yes |
| Standard | Advanced | |
| Min. Finished Hole Size (Mechanical) | 0.20mm | 0.10mm |
| Min. Finished Hole Size (Laser) | 0.10mm | 0.05mm |
| Minimum Punched Hole Size | 0.80mm | 0.70mm |
| Standard | Advanced | |
| Track & Gap | ±20% | ±10% |
| Layer Registration | ±0.10mm | ±0.10mm |
| Standard | Advanced | |
| Hole Diameter (PTH) | ±0.075mm | ±0.050mm |
| Hole Diameter (Non-PTH) | ±0.10mm | ±0.050mm |
| Hole Diameter (Punched) | ±0.15mm | ±0.10mm |
| Hole Location | ±0.05mm |
| Standard | Advanced | |
| Track & Gap | ±20% | ±10% |
| Standard | Advanced | |
| Via Plugging (100% Fill) | –20% | -10% |
| Via Plugging Hole Size | ≤0.50mm | ≤0.60mm |
| Registration | 0.025mm | 0.020mm |
| Solder Dam Width | Min. 0.15mm | Min. 0.10mm |
| Thickness Over Trace (Surface) | Min. 10µm | Min. 15µm |
| Solder Mask Pad Size | Min. 15µm |
| Standard | Advanced | |
| Maximum board thickness | 6.00mm | 10.00mm |
| Minimum board thickness | 0.30mm | 0.20mm |
| Minimum Track / Gap Inner layer | 0.10mm | 0.05mm |
| Minimum Track / Gap Outer layer (35µm) | 0.10mm | 0.05mm |
| Finished PCB Thickness | ±10% | |
| Routing Profile | ±0.15mm | ±0.10mm |
| V-Cut profile | ±0.15mm | ±0.10mm |
| Standard | Advanced | |
| % Tested (Open / Short test) | 100% | 100% |
| QFP Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
| BGA Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
| Connector Pitch | 16mil (0.40mm) | 12mil (0.30mm) |
| Standard | Advanced | |
| AOI | All Multilayer | All Multilayer |
| Impedance Control | ± 10% | ± 5% |
| Solderability Testing | As standard | As standard |
| Ionic Contamination | On Request | On Request |
| Microsecion Reports | On Request | On Request |
| Hi-Pot Testing | On Request | On Request |
| BLIND VIAS, BURIED VIAS, SEQUENTIAL LAMINATION, FLEX-RIGID MULTILAYERS, COPPER COIN INSERTS, CERAMIC INSERTS, DIRECT THERMAL EXCHANGE (DTE), HEAVY COPPER |
| PLATED SLOTS, EDGE PLATING, COUNTERSINKING, EDGE BEVELLING, JUMP SCORING, BARCODING, BACK DRILLING, CASTELLATED HOLES, OTHERS AVAILABLE ON REQUEST |
| Board Type | Standard | Quick Turn |
| Single Sided | 10 Days | 3 Days |
| PTH | 10 Days | 5 Days |
| Multilayer | From 10 Days | From 3 Days |
| Board Type | Manufacturing Lead Time |
| Quick Turn ≤ 5sqft | From 5 Days |
| Single Sided | 10 – 20 Days dependant on volume |
| PTH | 15 – 25 Days dependant on volume |
| Multilayer | 15 – 30 Days dependant on volume & Technology |
| Air Freight Lead Time – 4 Days |
| Sea Freight Lead Time – 20 Days |
| All Far East lead times are subject to customs clearance |
| Premium International shipments can be arranged by DHL, Fedex, UPS or TNT at extra cost |
Daleba can manufacture PCBs ranging from single-sided to complex boards in excess of 40x layers. Our in-house CAM engineering resource allows us to rapidly check, panelise and commercially optimise a fast turnaround prototype as well as small volumes. We can supply simple technology boards in as little as 24 hours!
